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Jinwoo Lee1 Woojoo Kim1 Ohmin Kwon1 Dongil Kwon1

1, Seoul National University, Seoul, , Korea (the Republic of)

Nano technology is developed consistently in all kind of industry like chemical, Bio, Energy. Especially thin-film process improvement and material changes is researching actively. Through variety material and processing, High quality thin film element must have clearly purpose for electric and optical ability and also request a reliable device which is over standard mechanical properties. A thin film’s reliable question is depend on interfacial characterization, so evaluating interfacial characterization is the most important things in this test. So far, Peel off test, 4 point bending test and scratch test are usually using among lots of test in order to evaluate a thin film’s feature. But those test is inconvenience to make sample, and hard to check a characteristic evaluation of characteristic interface because of mechanical properties. So, this research is introduced how to test a thin-film by indentation test, and confirmed availability of interfacial properties by nanoindentation test.
Determination of the mechanical properties of thin films on substrates by nanoindentation has always been difficult because of the influence of the substrate and interface on the measured properties. In order to measure film-only properties, a commonly used rule of thumb is to limit the indentation depth to less than 10% of the film thickness. As the film gets harder, the substrates and interfacial effects appear at lower indentation depth. Many researchers derived the conclusion from the theoretical and experimental methods. In the case of thin films which have thickness under than from nanometers to micrometers, it has no choice but must include the substrates and interfacial effects. Owing to the quantitative consideration about interfacial effects was hard, modeling equations with no interfacial effects is used.

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