Organic optoelectronic devices have witnessed significant advances in both material development and device performance over the past several decades. Recently, additive manufacturing has been applied to the fabrication of optoelectronic devices via utilizing various functional inks that are compatible with an extrusion-based 3D printing process. This has enabled the ability to additively print complex 3D optoelectronic architectures without the need for any traditional microfabrication processing techniques. Here, polymer photodetectors with high performance are fully 3D printed and thoroughly characterized. Specifically, functional inks are carefully selected for the constituent layers of the photodetector and semiconducting polymer ink is optimized for the active layer, achieving an external quantum efficiency of 25.3% and a specific detectivity of 8 × 1011 cm●Hz1/2/W. Significantly, these metrics are comparable to those of traditionally spin-coated counterparts, yet are fabricated solely via a one-pot custom built 3D printing tool housed under ambient conditions. The devices were integrated into image sensing arrays with high sensitivity and wide field-of-view, by 3D printing interconnected photodetector arrays onto flexible substrates and directly onto hemispherical surfaces. It is further demonstrated that this approach can be extended to create fully integrated multifunctional devices consisting of optically coupled photodetectors and light emitting diodes which are both fully 3D printed on a single platform, showing for the first time the multifunctional integration of multiple semiconducting device types on an integrated platform.The 3D printed optoelectronic devices introduced here simplify fabrication procedures by eliminating the need for any conventional microfabrication facilities, enhancing the flexibility for the design and manufacture of next-generation wearable and 3D structured optoelectronics, and validating the potential of 3D printing to achieve integrated active electronic materials and devices.